发明名称 ALUMINUM ALLOY FOR BONDING WIRE
摘要 PURPOSE:To inhibit the formation of oxidized film of aluminum to form an excellent ball and to increase the bonding strength and to obtain the titled alloy large in wire strength and excellent in wiredrawing workability by constituting the alloy of Be and Ni of specified quantity and the balance Al essentially. CONSTITUTION:Aluminum alloy for a bonding wire consists of 0.002-0.2wt% Be, 0.5-3wt% Ni and if necessary, 0.5-2wt% one or more kinds selected among Si, Mg, Mn and/or 0.02-0.5wt% one or more kinds selected among Zr, Ti, Cr, V, Cu, B and the balance Al essentially. At the time of forming a ball, the formation of an oxidized film of Al is inhibited to form the excellent ball and to increase the bonding velocity. The remarkable softening and brittleness close to the ball forming parts are prevented to increase the bonding strength and the reliability is increased. The aluminum alloy is large in wire strength and excellent in wiredrawing workability and enabled to low cost.
申请公布号 JPS60248858(A) 申请公布日期 1985.12.09
申请号 JP19840104353 申请日期 1984.05.22
申请人 SUMITOMO DENKI KOGYO KK 发明人 NISHIDA MASANORI;YOKOTA MINORU;SAWADA KAZUO
分类号 C22C21/00;C22C21/02;C22C21/06 主分类号 C22C21/00
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