| 摘要 |
PURPOSE:To obtain film thickness, through which the generation of a soft error due to the projection of alpha-rays can be prevented, by dropping a resin agent having required viscosity onto the surface of a metallic thin-film having excellent adhesive properties with a resin film and curing the resin agent. CONSTITUTION:A metallic thin-film consisting of a high melting-point metal, such as titanium, titanium-tungsten, etc. having excellent adhesive properties with a resin film is formed to the surface of a passivation film 3 shaped to a section except bonding pads 2, and a metallic thin-film 6 is formed while leaving sections corresponding to sections, where the soft errors of a circuit pattern shaped to the main surface section of a semiconductor chip 1 are generated, through photolithography treatment. A polyimide resin agent, which does not contain a radioactive element and has viscosity of approximately 5,000cps, is dropped onto the surface of the metallic thin-film 6, and a resin film 5b for preventing the projection of alpha-rays is obtained through curing. The resin film 5b does not protrude from the upper section of the surface of the metallic thin-film by the viscosity of the resin agent even when the thickness of the resin agent is thickened, and can be formed in desired thickness. |
