发明名称 THIN FILM FORMATION EQUIPMENT
摘要 PURPOSE:To substantially prevent the adhesion of a product to a window by providing in parallel many groups of slits which correspond to the windows. CONSTITUTION:Reactive gases 31-33 which will be made a solid product after reaction are supplied to a reaction chamber 2 and reactive gases or inert gases 34, 35 which will not be made a solid after the reaction are supplied to a light source chamber 5. These gases go to the reaction chamber for reaction through a slit during the reaction and impurity 8 is exhausted. Ultraviolet ray is widened and a surface to be formed is dually irradiated by the light from the adjacent slits uniformly as if from a light source. A heater is positioned at the upper side of the reaction chamber for deposition up system and making the cause for pin hole due to the adhesion of a flake to the surface to be formed is avoided. In addition, the heater heats a mercury lamp and the elongation of the wave length of the light due to the rise of the temperature of the mercury lamp is avoided. Further, the high frequency energy from a high frequency power source 13 can simultaneously be maintained between a stainless steel plate having the slits and a substrate 1.
申请公布号 JPS60245217(A) 申请公布日期 1985.12.05
申请号 JP19840102900 申请日期 1984.05.21
申请人 HANDOUTAI ENERUGII KENKYUSHO:KK 发明人 YAMAZAKI SHIYUNPEI
分类号 H01L21/205;C23C16/00;C23C16/48;H01L21/26;H01L21/31;H01L31/04 主分类号 H01L21/205
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