| 发明名称 |
LOWER TEMPERATURE GLASS AND HERMETIC SEAL MEANS AND METHOD |
| 摘要 |
<p>An improved lead-free glass or glass plus alumina ceramic sealing material for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent: - Composition Range -Element Pb-free Glass (Glass plus alumina) -SiO2 40-50 34-50 -Al2O3 2-12 2-25 -K2O 2-6 2-6 -Na2O 5-9 4-9 -Li2O 2-6 2-6 -CaO 0-4 0-4 -ZnO 5-12 4-12 -BaO 1-5 1-5 -TiO2 2-6 2-6 -B2O3 13-21 11-21 -</p> |
| 申请公布号 |
EP0091909(B1) |
申请公布日期 |
1985.12.04 |
| 申请号 |
EP19820902879 |
申请日期 |
1982.08.30 |
| 申请人 |
MOTOROLA, INC. |
发明人 |
DAVIS, EARL K.;LANDRON, RAFAEL;TAYLOR, SCOT, W. |
| 分类号 |
H05K5/06;C03C8/04;C03C8/14;C03C8/24;C03C27/02;H01L23/10;(IPC1-7):C03C3/064;C03C3/089 |
主分类号 |
H05K5/06 |
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