MODULE, AND METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to modules and methods for the production thereof. In said modules, planar electronic components that are designed on a flexible substrate are to be interconnected in an electrically conducting manner, and several electronic components are to form a series connection. The aim of the invention is to design modules which are inexpensive to produce and in which defects in individual electronic components or in electrically connecting connections between electronic components can be easily compensated. Said aim is achieved by a module in which planar electronic components are formed that are each provided with an optically active layer which is formed on a base electrode and is covered by a cover electrode, the base electrode being formed on a flexibly deformable substrate. The cover electrode protrudes from the optically active layer on one side while the base electrode protrudes from the optically active layer on the opposite side of the electronic component. The components are arranged on the substrate at a distance from one another, thus creating a free substrate surface between components such that the base electrode and the cover electrode of adjacent electronic components planarly rest against each other and an electrically conducting contact is established when the substrate is folded in the area of the free substrate surface.