| 摘要 |
DEVICE ENCLOSURE FOR HIGH DENSITY TAPE BONDING A package for an integrated circuit is disclosed which provides higher reliability and higher density tape bonding. The package includes an insulating substrate 10 having an array of openings 30 extending from an upper surface to a lower surface, and having an integrated circuit 15 mounted on the upper surface. The package further includes a pattern 20 of electrically conductive leads disposed on the upper surface of substrate a first series of elec-trical connections 40 between the integrated circuit 15 and the pattern 20, a frame 22 attached to the upper surface of substrate and a series of pins 35 for making electrical connections to pattern 20. The package is fabricated by attaching a layer of electrically conductive material 20 to an upper surface of the substrate 10, selectively removing undesired portions of the electrically conductive material to form the desired pattern of regions 20, attaching a frame 22 to the pattern 20 except where the integrated circuit 15 is to be attached, and providing electrical connections 32 and 35 between the pattern 20 and the bottom of substrate 10. |
