发明名称 PHOTO-DRIVEN SEMICONDUCTOR DEVICE
摘要 PURPOSE:To increase the strength of adhesion and to improve the hermetic property by using hard solder for welding a photo receiving window to the casing of a photo trigger thyristor via metallic member. CONSTITUTION:An internal light guide 7 is led to an optical transmission body 10 (light receiving window) through the aperture 9 of the casing 8. The transmission body 10 is fixed to the above-mentioned casing 8 with metallic members 13' and 12. In a structure for transmission body installation thus constructed, using sapphire as the transmission body 10, it is brazed to the metallic member 13' with Ag solder 15 having a welding temperature of 960 deg.C. Next, the metallic member 13' is brazed to a sleeve 12 and the sleeve to the casing 8 with Ag-Cu series alloy solder 16 having a lower welding temperature than that of said solder 15. This method can yield the titled device excellent in adhesion strength and in hermetic holding for a long time.
申请公布号 JPS60241263(A) 申请公布日期 1985.11.30
申请号 JP19840096625 申请日期 1984.05.16
申请人 TOSHIBA KK 发明人 TSUNODA YOSHIAKI;MATSUDA HIDEO;ANDOU MASARU
分类号 H01L31/111;G02B6/42;H01L29/74 主分类号 H01L31/111
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