| 摘要 |
PURPOSE:To make it possible to perform high density mounting in three dimensions and to facilitate the connection of parts at every layer, by bending two lead terminals at the same potential, which are taken out of the terminal surfaces of resin molded electronic parts in the different directions, and connecting the electronic parts, which are layered on the electronic parts, by using lead terminals. CONSTITUTION:Electronic parts 6, 7 and 8 are laminated type composite capacitors. Electronic parts 3, 4 and 5 are guided to the outside by taking out leads 18. Each semiconductor chip 16 is connected by a piece of wire 17 in each electronic part. Two terminal having the same potential are bent up and down. At the terminal end of the composite capacitor 8, terminals 11 are provided at 12 positions. Inner electrode 14 and 15 are taken out. The lead terminals, which are taken out of the electronic parts 3, 4 and 5 and, bent up and down, correspond to the terminals 11 of the end surfaces of the composite capacitors 6, 7 and 8 and are connected to those positions by solder. The terminators of the laminated composite capacitors 6, 7 and 8 are made to be standardized terminals. The lead terminals from the end surfaces of the electrode parts 3, 4 and 5, which are to be connected to said terminals, are selectively connected. |
