MOUNTING SUBSTRATE WAFER, MULTILAYER CERAMIC SUBSTRATE, MOUNTING SUBSTRATE, CHIP MODULE, AND MOUNTING SUBSTRATE WAFER MANUFACTURING METHOD

摘要

A wafer for mounting substrates according to the present disclosure includes a multilayer ceramic substrate including top face electrodes, bottom face electrodes, and internal electrodes providing connection between the top face electrodes and the bottom face electrodes, and a wiring pattern formed on a top face of the multilayer ceramic substrate. The wiring pattern has a minimum line width which is equal to or less than 2 µm and a minimum line space which is equal to or less than 2 µ m. When the wafer for mounting substrates is zoned into a plurality of regions by the units of 20 mm x 20 mm, at least 50% of the regions satisfy the condition that an SFQR in 20 mm x 20 mm evaluation region be equal to or less than 2 µm, at the top face of the multilayer ceramic substrate.