发明名称 HOT DIPPING METHOD
摘要 PURPOSE:To obtain a film of a uniform thickness by hot dipping independently of the temp. of environment when a material to be hot dipped is pretreated and dipped in molten metal, by storing and pretreating the material at the same constant temp. CONSTITUTION:A drum 1 having a wound material 2 to be hot dipped is stored in a thermostat 9, and the material 2 is drawn out in the direction of an arrow 3 and pretreated with a pretreating liq. 4a in a pretreating vessel 4 kept at the same temp. as the thermostat 9. The material 2 is then dipped in molten metal 5a at constant temp. in a hot dipping vessel 5 to carry out hot dipping, and after removing molten metal stuck in excess with a squeezing tool 6, the material 2 is cooled with a cooler 7 and wound around a winder 8. Thus, a film of a uniform thickness is always obtd. by hot dipping under simple control.
申请公布号 JPS60238466(A) 申请公布日期 1985.11.27
申请号 JP19840095293 申请日期 1984.05.11
申请人 HITACHI DENSEN KK 发明人 ISHIDA AKINORI;OOSHIMA MASAO
分类号 C23C2/00;C23C2/02 主分类号 C23C2/00
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