3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT

摘要

Provided herein is an apparatus including a first CMOS wafer and a second CMOS wafer. A eutectic bond connects the first CMOS wafer to the second CMOS wafer. The eutectic bond includes aluminum and germanium, and the eutectic bond has a melting point which is lower than the melting point of aluminum and the melting point of germanium.