Test socket for a leadless chip carrier

摘要

A socket is provided for testing leadless chip carriers. The socket has a base with a resilient pad. A planar assembly of coaxial cables is positioned above the base so that a terminal contact of each cable is located on the resilient pad in alignment with the contacts on the chip carrier. A frame is coupled to the planar assembly of coaxial cables and to the base. The frame has an opening for receiving and aligning the contacts of the carrier with the contacts of each coaxial cable. The socket has a cover which is hinged and latched to the base. A screw threaded through the cover is used to apply pressure to the carrier in the socket.