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发明名称
METHOD AND DEVICE FOR MELTING SOLDER OF ELECTRONIC PART
摘要
申请公布号
JPS60231391(A)
申请公布日期
1985.11.16
申请号
JP19840087312
申请日期
1984.04.29
申请人
YOKOTA KIKAI KK
发明人
YOKOTA HACHIJI
分类号
B23K3/04;B23K1/012;H05K3/34
主分类号
B23K3/04
代理机构
代理人
主权项
地址
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