发明名称 LEAD FRAME
摘要 PURPOSE:To obtain a lead frame, which has excellent adhesion and is coated by Al having excellent ultrasonic bonding property, by exhausing air, performing evaporation at a high speed by the irradiation of an electron beam, applying high frequency power, exciting evaporated particles, and performing coating. CONSTITUTION:A vacuum device is composed of a bell jar 1, a coating substrate 2, an evaporation source 3, a high-frequency exciting coil 4, an electron-beam emitting source 5 and an ion particle accelerator 6. The degree of vacuum in a vacuum container is made to be 5X10<-5>Torr or more. The distance between the substrate 2 and a crucible is made to be 1/10 or less the mean free path. The Al evaporation source 3 in the crucible is heated by the irradiation of the electron beam, and the Al is evaporated so that the vapor pressure of Al becomes 10<-3>mmHg or higher. High frequency power is applied to the high frequency coil 4, which is arranged between the Al evaporation source 3 and the coating substrate 2. Ionized, evaporated Al particles are accelerated by a DC field and attached to the substrate 2. The lead frame, in which the Al is coated on the surface of the substrate, is obtained.
申请公布号 JPS60231348(A) 申请公布日期 1985.11.16
申请号 JP19840087106 申请日期 1984.04.27
申请人 SUMITOMO DENKI KOGYO KK;SHINGIJIYUTSU KAIHATSU JIGIYOUDAN;MURAYAMA YOUICHI 发明人 OGASA NOBUO;OOTSUKA AKIRA;KANEHIRO KAZUO
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
代理机构 代理人
主权项
地址