| 摘要 |
PURPOSE:To obtain the titled material having improved adhesivity between the filler and the resin, high moisture resistance, and remarkably improved corrosion resistance, and suitable for the sealing of a semiconductor device such as IC, by compounding an epoxy resin with an organic filler coated with an organopolysilsesquioxane. CONSTITUTION:An inorganic filler (e.g. crystalline silica powder, quartz glass powder, etc.) is immersed and mixed in a silicon resin solution having a concentration of 1-50wt% and composed of an organopolysilsesquioxane of formula (R1 and R2 are methyl, phenyl, etc.) and an organic solvent (e.g. benzene, toluene, etc.), and the mixture is filtered and dried. The product is compounded in an epoxy resin at a ratio of 60-70wt%.
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