HEAT DISSIPATING CONSTRUCTION OF IC,申请号JP19840060290U-传众专利搜索

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发明名称	HEAT DISSIPATING CONSTRUCTION OF IC
摘要
申请公布号	JPS60171751(U)	申请公布日期	1985.11.14
申请号	JP19840060290U	申请日期	1984.04.24
申请人		发明人
分类号	B60N2/20;B60N2/44;(IPC1-7):B60N1/10	主分类号	B60N2/20
代理机构		代理人
主权项
地址

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