发明名称 METHOD FOR MEASURING UNIFORMITY OF ETCHING PROCESSING
摘要 PURPOSE:To measure uniformity of etching processing by utilizing aging of particular light emitting spectrum during the etching of sample to be used for judging the end point of etching. CONSTITUTION:A signal such as a particular light emitting spectrum intensity waveform 8 recorded by a pen recorder 4 with the time is input to an operation apparatus 5. When etching completes even at a point in the sample 2, the particular light emitting spectrum intensity suddenly starts to reduce like a point A. when etching further advances, the particular light emitting spectrum intensity reaches the point B and starts to saturate. Thereby, the time from start of etching to sudden reduce of particular light emitting spectrum intensity and the time from start of etching to start of saturation after sudden reduce of particular light emitting spectrum are obtained and thereby uniformity of etching for sample can be calculated and measured using obtained times.
申请公布号 JPS61110433(A) 申请公布日期 1986.05.28
申请号 JP19840230136 申请日期 1984.11.02
申请人 HITACHI LTD 发明人 TAKADA KAZUO;OGAWA YOSHIFUMI
分类号 H01L21/302;H01L21/3065;(IPC1-7):H01L21/302 主分类号 H01L21/302
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