| 摘要 |
PURPOSE:To obtain a strong glass-sealed semiconductor device having high airtightness and a packaging density, by covering the side faces of a substrate and a part of the vertical portions of an external lead with a cap. CONSTITUTION:A ceramic cap 2 covering the vertical portions of an external lead 5 is extended to the same level with the bottom of a ceramic substrate 3. Low-melting glass 4 is provided on the upper surface 31 and the side surfaces 32 of the substrate. Thus, sufficient airtight seal can be obtained even if the sealing extension on the upper surface 31 is decreased, and a large-sized semiconductor can be received therein. Further, the strength of the device itself is increased while the external lead is protected, and thus the reliability is improved. |
