| 摘要 |
<p>PURPOSE:To improve the element characteristics of chip by a method wherein means to relieve the stress on a chip are taken on the backside of package main body excluding the part opposing to the chip. CONSTITUTION:Means to relieve the stress on the chip are taken on the backside of package main body excluding the part opposing to the part near chip. For example, the film thickness of package main body 21 separated from a chip 1 is made thinner while the film thicknesses of upper and lower parts of package main body 21 are made equivalent to each other. Through these procedures, the fulcrums of stress when the package main body 21 is warpted are divided into three points i.e. P1 as the central point of chip 1, P2, P3 as the points on the marginal lines where the film thickness of package main body 21 begins to change. Resultantly the characteristics of chip 1 may be prevented from deteriorating since the stress on the chip 1 when the package main body 21 is warped by any ambient environmental change may be reduced to the minimum.</p> |
