| 摘要 |
PURPOSE:To narrow down electrode width and to lower an operating voltage, and to improve light transmissivity by providing an internal laminar electrode which extends in a light transmission direction between chip substrates laminated in an array. CONSTITUTION:Metallic electrodes 2' with thickness W/2 are vapor-deposited on both top and reverse surfaces of a wafer 1' with thickness (g) in out-of-phase relation and diced to width (t) to form a number of chip substrates 1, which are rearranged and laminated so that electrodes 2' and 2' come into contact with each other. Then, the electrodes 2' and 2' are bonded together by compression into an internal laminar electrode 2, an electric insulating agent 3 is charged in and outside of the gap between chip substrates 1 and 1, and flank electrodes 4 and 4 are fitted to constitute a couple of comb-shaped electrodes having opposed electrodes 2, 2.... Consequently, the thickness W of electrodes 2 and the electrode gap (g) are reduced to obtain a low operating voltage and high light transmissivity. |
