发明名称 MANUFACTURE OF CHIP INDUCTOR
摘要 PURPOSE:To connect reliably at a very small area a metal plate terminal and a coated copper wire with a small diameter and to raise mass-productivity, by a method in which, after a coated copper wire is contacted over a metal plate terminal and they are put between a pair of welding electrodes in order to break down with heat the insulating film of the coated copper wire, the wire core and the metal plate terminal are welded and connected. CONSTITUTION:A metal plate terminal 8 is placed on a second electrode 10, a coated copper wire 12 is contacted at the connecting portion, and a first electrode 9 is contacted on the coated copper wire with a predetermined pressure applied. The first electrode is caused heating current 16 from a transformer to flow while keeping the pressurized state, heating the first electrode 9. At this time, the heat breaks down the insulating film 19 of the coated copper wire while it melts and removes the surface soldering plated layer 21 of the metal plate terminal 8 at the connecting portion. Next, welding current 17 which flows across the first electrode 9 and the second electrode 10 from a transformer 15 welds and connects the metal plate terminal 8 with the wire core 18 of the coated copper wire 12. At the same time, the soldering plated layer 21 is melted again and solders the wire core 18 so as to cover the portion of the wire core 18.
申请公布号 JPS60224209(A) 申请公布日期 1985.11.08
申请号 JP19840080452 申请日期 1984.04.20
申请人 MATSUSHITA DENKI SANGYO KK 发明人 IWAMI TOMOKO;YAMAMOTO HIROMASA;TAOKA MIKIO;KITANO YUKIHIRO;IMAI SUNAO
分类号 B23K11/00;B23K11/16;H01F41/04;H01F41/10 主分类号 B23K11/00
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