| 摘要 |
PURPOSE:To obtain a complete insulating type product, in which a mold clamping section is buried in a resin and a projecting section as seen in the conventional devices is removed, by using a movable mold clamping member which can be drawn out after a resin seal. CONSTITUTION:A mold clamping section 17 in a radiator 11 for a semiconductor element 2 does not extend up to the side wall of a resin injection space 4 formed by a top force 15 and a bottom force 16, a movable mold clamping member 20 is projected into the sealing space 4 from the molds in place of no extension of the mold clamping section 17, and supports the radiator 11 by the fitting of a crest form and a root form together with the mold clamping section 17 in the radiator, and the radiator 11 is positioned precisely in the sealing space 4. A resin seal is completed, the movable mold clamping member 20 is drawn out horizontally, and a product sealing is extracted to the outside from the molds. Accordingly, the product in which the mold clamping sections are drawn in as draw-in holes 21 for a sealing resin 10 is obtained. |
