| 摘要 |
A compact assembly is formed from a housing heat sink (GK) and a printed-circuit board (L) which is fitted with electrical components (B1 to B3, T1, T2) on one side. In this case, recesses (A1, A2), through which pegs (Z1, Z2) of the housing heat sink (GK) are guided, are provided in the printed-circuit board (L) in the region of power semiconductors (T1, TR2) which are to be cooled and are arranged thereon. The pegs (Z1, Z2) are connected in a heat-conducting manner to the power semiconductors (T1, T2) which are to be cooled. <IMAGE>
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