| 摘要 |
PURPOSE:To improve examining efficiency by a method wherein a probe card are provided with probes that independently contact different semiconductor devices, respectively, so that the number may increase of the characteristics or of semiconductor devices that can be examined simultaneously. CONSTITUTION:Eight probes 6 are positioned along the rim of a circular hole in a probe card 5 and four of the probes 6 are arranged so that, when the probe card 5 is loaded on an examining unit, they may apply voltages to or measure the same in semiconductor devices placed on a wafer 3 just under the circular hole. Connection to external circuits of the probes 6 and the card 5 is established by a wiring circuit printed on the card 5 or by coaxial cables 8 and the probes 6 themselves may be co-axial. For instance, after a simultaneous deterimination of the forward voltage in a device 91 and of the zero bias capacity in a device 93, the wafer 3 is moved by a pitch for the simultaneous examination of devices 92, 94. A single examining scan over the wafer 3 complete two measurements for the wafer 3. An increase in the number of performance characteristics or semiconductor devices that are subjected to examination simultaneously results in improved examining efficiency. |
