| 摘要 |
PURPOSE:To conduct an accurate test of any fine foreign matter adhered on the surface of an LSI wafer or the like, by detecting the adhered position with an optical means while observing and analyzing it with a scanning microscope. CONSTITUTION:S polarization laser light is applied onto a wafer 1 by an S polarization laser 27 of a foreign matter detecting unit 12. A polarizing plate 29 is provided behind an objective 28. Any light passing through them is detected by a photoelectronic device 30, and then only the scattered light from a foreign matter (P polarization component) is detected for detecting the position of the foreign matter on the LSI wafer provided with a circuit pattern. At a leading edge of a foreign matter detection signal 23, outputs of encoders 15 and 20 are latched in a coordinate storage 22 so that the position of the foreign matter is stored therein. A movable stage 16 is moved by a motor 19 into the field or view of a scanning electron microscope SEM13. Motors 14 and 19 are driven by a material scanning unit 21 according to the data stored in the storage 22 so as to position the stages 11 and 16 appropriately. The signal from the SEM13 is analyzed to obtain data of the foreign material. |
