发明名称 TERMINAL FOR CERAMIC LAYER PACKAGE
摘要 PURPOSE:To obtain a terminal characterized by easy, reliable attachment, easy production and excellent conductivity, by applying silver solder in the main body of a tubular terminal, and coating the outer surface part with a film having excellent conductivity. CONSTITUTION:A terminal main body 11 is formed in a tubular shape by a sealing material such as Cobal, alloy of iron, nickel and cobalt, alloy of iron, nickel and chromium, alloy of iron and nickel and alloy of iron and chromium. A silver solder spigot 12 is inputted in the terminal main body 11. A wire material is formed by drawing. The body is cut and a film 13 is formed. Thus the terminal is completed. Or, the film 13 is formed on the wire material and thereafter the material is cut. Thus the terminal is completed. The film 13 is formed by the plating of one of tin, zinc, aluminum, silver or gold, copper alloy, silver alloy and the like. When the terminal is attached to a ceramic layer package, the terminal can be fused and fixed without using a silver solder chip.
申请公布号 JPS60218861(A) 申请公布日期 1985.11.01
申请号 JP19840073950 申请日期 1984.04.14
申请人 FUJIYOSHI KATSUSATO 发明人 FUJIYOSHI KATSUSATO
分类号 H01R4/02;H01L23/49;H01L23/498;H01L23/50 主分类号 H01R4/02
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