| 摘要 |
<p>PURPOSE:To prevent troubles to be given to wafers after dicing and the titled device by a method wherein a treated wafer is removed by attracting the other main surface thereof to a Bernoulli's chuck. CONSTITUTION:A wafer finished in dicing is released from the vacuum attraction generated by a dicing table, and is levitated from the table by blowing up air, then, this wafer is fed to the next process of washing under the attraction by a Bernoulli's chuck standing by above. This chuck has the structure that the air supplied through a tube 19 from a plurality of nozzles 18 provided almost at the center of a wafer-holding surface 17 having a size corresponding to the area of a wafer. The air acts to attract wafers according to the Benoulli's principle. Therefore, in case of attraction of a wafer surface wet with water and the like, problems such as the attraction of water and the like to attraction vacuum pipes and the fixing of dicing waste, etc. to the surface caused by attracting action can be eliminated.</p> |
