| 摘要 |
A process and electrodialytic cell for electrodialytically regenerating an aqueous, spent electroless copper plating bath which contains alkali metal salts as reaction products of the electroless plating process. In the process, the spent copper plating bath is introduced into a regeneration compartment of an electrodialytic cell. Anions of the alkali metal salts in the spent copper plating bath are electrodialytically transferred through an anionic membrane into an acid formation compartment. Hydroxyl ions are electrodialytically transferred through the anionic portion of a bipolar membrane to a regeneration compartment to regenerate the bath. The electrodialytic cell of the invention has means for establishing and maintaining in a plurality of regeneration compartments the spent electroless copper plating bath. The apparatus also includes means for electrodialytically transferring anions of the alkali metal salts in the spent copper plating bath from a plurality of regeneration compartments into a plurality of acid formation compartments through a plurality of anionic membranes, with at least one anionic membrane being associated with each acid formation compartment. The electrodialytic cell additionally includes means for electrodialytically transferring hydroxyl ions into the regeneration compartments through the anionic portion of a plurality of bipolar membranes, with at least one bipolar membrane being associated with each acid formation compartment.
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