发明名称 PLASMA TREATING APPARATUS
摘要 PURPOSE:To shorten the time of gas feeding step and to finely regulate gas pressure by connecting a large flow rate tube for bypassing part of a tube with a gas feed tube, and connecting one end of a gas exhaust tube with a vacuum evacuating unit for evacuating a vacuum vessel. CONSTITUTION:A vacuum vessel 1 is evacuated by a vacuum evacuating unit 11, gas is fed by a gas feeding unit, and the vessel 1 is contained with gas atmosphere at the prescribed pressure. Gas is fed from a gas guide tube 3, a gas plasma is generated by a plasma generator 5, an article 2 to be treated is injected from a gas inlet, the gas plasma is exhausted from a gas outlet by the unit 11, the jet stream of the gas plasma is formed from the gas inlet to the gas outlet, and gas flow is regulated by a needle valve 7C of a gas exhaust tube 4 to maintain the gas pressure in the vessel 1 constant. The jet stream of the gas plasma is contacted uniformly with the article 2 to reciprocate in the direction perpendicular to the jet stream of the plasma. Accordingly, the article 2 can be uniformly surface treated. Since a large flow rate tube 9 is used, gas feeding stroke time can be largely shortened, and the gas flow rat can be finely adjusted by the valve 7C.
申请公布号 JPS61124125(A) 申请公布日期 1986.06.11
申请号 JP19840245256 申请日期 1984.11.20
申请人 TOKUDA SEISAKUSHO LTD 发明人 ONDA TOICHI;HOSAKA TAKEO;YOSHIKADO YAMATO
分类号 H01L21/302;H01L21/205;H01L21/3065 主分类号 H01L21/302
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