| 摘要 |
PURPOSE:To eliminate the damage of a package in heating and to improve reliability, by applying machining, which deteriorates the adhesion with molding resin, to a part of the surface of an island support, and excluding swelled water content yielded in heating. CONSTITUTION:Wire bonding is performed by Au wire 4. Then sealing is performed by a molding resin 5. At this time, a product obtained by growing a transfer mold at 160-180 deg.C is removed from a molding jig. Immediately after the removal, the product is quickly cooled by cold water. By utilizing the difference in expansion coefficients {molding resin 5X10<-5>/ deg.C, 4-2 alloy (lead frame) 7X10<-6>/ deg.C}, adhesion between an island support 1 and the molding resin 5 is deteriorated (Part D). At the time of die bonding of the product, the island support 1 (alloy of 4-2 alloy iron and nickel) of the lead frame is heated for several seconds at a temperature of 400 deg.C or more in an atmosphere, in which the surface is liable to be oxidized. The product, which has an oxide film E whose thickness is 1,000Angstrom or more on the surface, is sealed by the molding resin 5. |
