发明名称 PB ALLOY BRAZING FILLER METAL FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve airtight sealability and heat conductivity by forming a Pb alloy brazing filler metal of a compsn. contg. specific % of 1 or >=2 kinds of Sn and In and the balance Pb and impurities and controlling the oxygen content in the impurities to a prescribed range. CONSTITUTION:A Pb alloy brazing filler metal is made by a vacuum melting method, etc. Said metal is incorporated with 1-65% 1 or 2 kinds of Sn and In, is incorporated further with 1-10% Ag and consists of the balance Pb and inevitable impurities. The content of oxygen as the inevitable impurity is controlled to 1-<20ppm. The Ag component is incorporated therein according to need in order to improve wettability and adhesion strength. Since the oxygen component in the impurities is low, the void amt. to be generated during brazing is extremely decreased and the brazing with the improved airtight sealability and heat conductivity is attained.
申请公布号 JPS60206596(A) 申请公布日期 1985.10.18
申请号 JP19840063032 申请日期 1984.03.30
申请人 MITSUBISHI KINZOKU KK 发明人 HOSODA NAOYUKI;UCHIYAMA NAOKI;TAKAKU KIYOSHI
分类号 C22C11/00;B23K35/26;H01L21/52;H01L21/58 主分类号 C22C11/00
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