| 摘要 |
PURPOSE:To reduce occurrence of voids in molding resin by bringing a plurality of tablets into contact, applying heat and pressure to them, then, cooling their surfaces and hardening the surfaces only. CONSTITUTION:Tablets 30 are put in the cylindrical housing 21 of the tablet molding apparatus 20. The high frequency electric field 14 is made between the lower 13 and the upper electrode 12 to apply heat and pressure to the tablets. The tablets melt themselves to make one body. After the tablets have made one body, water is sent into the tube part 25 installed in the cylindrical housing 21 wall of the tablet molding apparatus 20 and the temperature of the cylindrical housing 21 and that of the tablet 30 surface in contact with this housing are cooled so that they are made at least 5 deg. lower than the inner part. When they are cooled in this manner, hardening is conducted from the surfaces of the tablets 30 and no voids break out. |
