| 摘要 |
PURPOSE:To provide a simplified method for protecting semiconductor integrated circuit elements from moisture by a method wherein undercoat and overcoat layers are formed of a specified material to coat the elements. CONSTITUTION:A passive element 12 typically a chip capacitor, and a semiconductor integrated circuit element 13, typically a flip chip type IC chip, are positioned on the surface of a substrate 11 made of alumina or the like. To constitute an undercoat layer 14 to surround the element 13, a slicone gel is used. Such a silicone gel should adhere well to the element 13 as well as to the substrate 11 and, for excellent damp-proof property, should demonstrate a water saturation rate of not more than 0.2% in a boiling test. For an overcoat layer 15, a phenol resin, silicone rubber or silicone resin is used, allowing easy entry and departure of water, which takes not more than 5hr before attaining half the water saturation rate in a boiling water test. |
