发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the generation of cracks in a sealing section, and to enable hermetic sealing by sealing a substrate manufactured by a material mainly comprising silicon carbide and a cap by amorphous sealing glass. CONSTITUTION:A pellet 3 consisting of silicon is fixed at the central section of one surface of a substrate 1 through a gold-silicon eutectic section 2. Electrode sections for the pellet 3 are bonded and connected with the inner end sections of leads 5 as external terminals by wires 4. The leads 5 are sealed hermetically under the state in which they are held between a cap 7 made of alumina or mullite and the SiC substrate 1 by sealing glass 6. The sealing glass 6 is composed of amorphous sealing glass mainly comprising lead, and has a small thermal expansion coefficient and is fixed positively.
申请公布号 JPS60202955(A) 申请公布日期 1985.10.14
申请号 JP19840058273 申请日期 1984.03.28
申请人 HITACHI SEISAKUSHO KK 发明人 SAWARA KUNIZOU;OOTSUKA KANJI;SEKI MASATOSHI;ISHIDA TAKASHI
分类号 H01L21/52;H01L21/58;H01L23/08;H01L23/10 主分类号 H01L21/52
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