发明名称 BINDER FOR PASTE SOLDER
摘要 PURPOSE:To improve the characteristics required for a binder by combining prescribed wt% of an org. gelling agent with specific % of acrylic resin and methyl ethyl ketone. CONSTITUTION:The compsn. consisting of 10-40% acrylic resin powder, 0.1-2% org. gelling agent and the balance methyl ethyl ketone is mixed and agitated then the mixture is heated in a hot bath for 1hr at about 65 deg.C. The mixture is then allowed to cool in the atm. down to the ordinary temp. If the paste solder is manufactured by mixing and agitating adequately the binder for paste solder obtd. by the above-mentioned method and solder powder, the sepn. or corrosion of the solder powder during storage is obviated and the oxidation of the base metal to be brazed is obviated as well. No spatters and residues are generated during brazing. The various characteristics required for the binder are improved by the above-mentioned method.
申请公布号 JPS60203390(A) 申请公布日期 1985.10.14
申请号 JP19840057731 申请日期 1984.03.26
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 SHIMADA TAKAYA
分类号 B23K35/22;B23K35/36;C09D191/06 主分类号 B23K35/22
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