发明名称 |
HEAT RESISTANT STYRENE BASED RESIN EXTRUSION FOAM BOARD |
摘要 |
PURPOSE:To obtain a foam board resistant to heat above 90 deg.C by extrusion foaming a styrene-alpha methylstyrene-acrylonitryl copolymer. CONSTITUTION:100pts.wt. of styrene-alpha methylstyrene-acrylonitryl copolymer produced by polymerizing 100pts.wt. of styrene with 60-700pts.wt. of alpha methylstyrene and 40-400pts.wt. of acrylonitryl is extrusion foamed in the presence of 2-30pts.wt. of a volatile foaming agent. The thermal deformation start temperature of the styrene-alpha methylstyrene-acrylonitryl copolymer is most preferably in the range of 92-110 deg.C in a method prescribed by ASTM-D-648 (with a load of 18.6kg). Thus, an excellent heat resistant styrene-based resin extrusion foam board having a uniform fine cell structure can be obtained without impairing the heat resistance of the styrene-alpha methyl-styrene-acrylonitryl copolymer. |
申请公布号 |
JPS60199624(A) |
申请公布日期 |
1985.10.09 |
申请号 |
JP19840057067 |
申请日期 |
1984.03.23 |
申请人 |
KANEGAFUCHI KAGAKU KOGYO KK |
发明人 |
SHIGETANI SHIGERU;IGUCHI TAKESHI;HAYASHI HISATAKA;NAGATA MASAO |
分类号 |
B29C47/00;B29K55/00;B29K105/04;B29L7/00;C08J9/04;C08J9/12 |
主分类号 |
B29C47/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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