发明名称 FORMING METHOD OF ELECTRODE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To form an ohmic electrode on an n type ZnS crystalline substrate by mechanically polishing and chemically polishing one main surface of the n type ZnS crystalline substrate, evaporating Ga through a vacuum deposition method, pressure-welding an In metal on the surface of Ga and thermally treating the whole in a gas atmosphere. CONSTITUTION:A ZnS single crystal is manufactured through a high-pressure melting method, and has very high resistivity. When the resistance of the single crystal is lowered through treatment for 10hr at 1,000 deg.C in a Zn melt, a crystal 11 having low resistivity of several OMEGA.cm is obtained. The crystal 11 is mechanically polished by an alumina abrasive, and etched by pyrophosphoric acid, thus preparing a uniform surface. A Ga evaporating layer 13 in approximately 2,000Angstrom is formed on the surface. An In wire 15 is pressure-welded to the Ga evaporating layer 13 through ultrasonic vibrations using an ultrasonic vibrating terminal 14. The In wire is pressure-welded and thermally treated for 5min at 370 deg.C in an Ar atmosphere, thus forming an ohmic electrode.
申请公布号 JPS60198722(A) 申请公布日期 1985.10.08
申请号 JP19840054171 申请日期 1984.03.23
申请人 TOSHIBA KK 发明人 SATOU TOMOKO;KAWACHI MASARU;HIRAHARA KEIJIROU
分类号 H01L29/43;H01L21/28 主分类号 H01L29/43
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