| 摘要 |
PURPOSE:To provide an adhesive for a flexible printed circuit board consisting of a specified acrylic resin, an epoxy resin and a polyisocyanate, which bonds metal foil to plastic film strongly and has markedly improved resistance to thermal degradation of bonding strength. CONSTITUTION:The adhesive consists of 100pts.wt. (A) acrylic resin obtained by copolymerization of 15-35wt% acrylonitrile, 55-83wt% 5C or lower alcohol ester of (meth)acrylic acid and 2-10wt% (meth)acrylic acid, 5-70pts.wt. (B) epoxy resin and 20-100pts.wt. (C) polyisocyanate. The adhesive bonds metal foil (e.g. copper foil) strongly to plastic film (e.g. polyamide film) with markedly improved resistance to thermal degradation of bonding power. Satisfactory results are also obtainable for general properties including resistance to heat of soldering and solvent and electrical properties.
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