| 摘要 |
PURPOSE:To form a noble metal plating layer having excellent adhesiveness with a simple plating operation by disposing auxiliary cathodes on the outside of materials to be plated, dipping the materials into a plating bath by means of a hook, to subject the materials to substratum plating then removing the auxiliary cathodes and dipping the materials in an Au or Ag plating bath. CONSTITUTION:The metallic parts 3 to be plated are attached in a vertically lifted state to the hook 1 and the auxiliary cathodes 2 are attached by fittings 4 to the hook 1 on the outside of the parts 3. The parts are then dipped in the substratum plating bath and electricity is conducted to the bath to form the substratum metallic plating layer on the surface of the parts 3 to a uniform thickness. Only the cathodes 2 are thereafter removed and the parts are dipped into the Au or Ag plating bath to form the Au or Ag plating layer with the excellent adhesiveness on the substratum plating layer. Cu plating is executed as the substratum plating if the parts 3 are made of an Al or Mg metal and Ni plating is used as the substratum plating if said parts are of Ti, Ni, Mo metals or carbon fiber reinforced plastics.
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