| 发明名称 |
Punch and die mechanism |
| 摘要 |
|
| 申请公布号 |
US2874776(A) |
申请公布日期 |
1959.02.24 |
| 申请号 |
US19560631931 |
申请日期 |
1956.12.31 |
| 申请人 |
ROYAL MCBEE CORPORATION |
发明人 |
HOOE HUNTER E. |
| 分类号 |
G06K21/06 |
主分类号 |
G06K21/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
您可能感兴趣的专利
No-flow underfill for package with interposer frame
Method of manufacturing semiconductor device
Processes for multi-layer devices utilizing layer transfer
Double trench well formation in SRAM cells
Polysilicon resistor formation
Replacement gates to enhance transistor strain
Method of forming transistors with ultra-short gate feature
Method of forming a semiconductor device having a patterned gate dielectric and structure therefor
Method for forming an integrated circuit having a programmable fuse
Method for thinning, metalizing, and dicing a semiconductor wafer and, semiconductor device made using the method
Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus by using the same, and organic light-emitting display apparatus manufactured by the method
Thin film transistor, display device having thin film transistor, and method for manufacturing the same
Organic light-emitting display device and method of manufacturing the same
Integrated electronic assembly for conserving space in a circuit
Device and method for quantitatively determining an analyte, a method for determining an effective size of a molecule, a method for attaching molecules to a substrate, and a device for detecting molecules
Control over hydrogen fluoride levels in oxide etchant
Fermentation process for production of acetone, butanol and ethanol using isophoron as absorbent
Process for producing polypeptide
Method and apparatus for cutting and collecting dissected specimens
Method for electrochemical detection of binding reactions
