| 摘要 |
PURPOSE:To prevent solder from flying to a chip containing hole due to the pressure difference between the interior and the exterior of the hole by sealing the periphery of the hole by a sealer that a circuit board and a sealing cap are soldered at the contacting surfaces. CONSTITUTION:A circuit board 11 is integrated by laminating an upper layer ceramic sheet 13 having a window of the size capable of containing a semiconductor chip 10 on the upper layer of a lower ceramic sheet 12. A plurality of containing holes 15 are divided at the arbitrary positions and formed through a window of the sheet 13, a plurality of semiconductors 10 are divided and contained in the hole 15, and connected with the wiring surface 14. A sealing cap 17 is superposed between sealing conductor patterns 16 and 18 on the upper surface of the board 11 to surround so as not to fly the solder into the hole 15 due to the pressure difference of the interior and the exterior of the hole 15 in the step of sealing the chip 10 contained in the hole 25 with the solder. |
