| 摘要 |
PURPOSE:To largely reduce the zigzag of a center hole in case of punching in the formation of a lead frame for a semiconductor element by forming grooves at the prescribed interval at a wide coupling piece. CONSTITUTION:Both a relatively wide coupling piece 11 and a relatively narrow coupling piece 12 are in parallel, coupled by a bridging piece 13 at every prescribed interval to form a frame body 10, and groove 14 are formed by pressing substantially at the intermediate position between the adjacent two lead pieces 20. The grooves 14 are formed to slightly extend the piece 11. As a result, a balance between the pieces 11 and 12 can be held, and the zigzag of center holes 15 opened at the wide bridge piece provided suitably, i.e., the displacement from the center line A-A' can be suppressed to small value. |
