| 摘要 |
PURPOSE:To reduce the area of a bonding point without cutting a wire by sequentially bonding wires continued at the bonding point under the control of sequence on the basis of data, and cutting the wire after finishing the bonding work of the final bonding point. CONSTITUTION:A plurality of chips 11-n are aligned irregularly, wires 20 are sequentially continuously bonded without cutting at the midway, and the wires are separated from the wedge 21 at the final n pieces position. Geometrical data relative to three-dimensional coordinates of the bonding point in which the displacement compared with the position of the preset correct coordinates is detected at every bonding point by a camera placed on a bonding head, and stored, is used to correct and guide the head, and working conditions necessary for the bonding work stored separately such as the height of the loop, the power of the supersonic wave, the pressure and the applying time are used to continuously bond under the sequence control, and the wire is cut after the bonding work of the final bonding point is finished. |
