| 摘要 |
PURPOSE:To improve the mechanical strength by soldering the entire lower surface of a substrate to a heat sink plate in a soldering method of terminal in a hybrid integrated circuit device with a heat sink plate, thereby alleviating an inconvenience due to the difference of thermal expansion coefficients between the substrate and the heat sink plate. CONSTITUTION:An upper holding piece 8a of a lead terminal 7a in which the lower holding piece 8b of an end clip is removed is pressed on a terminal connecting conductive land 3 provided at the edge of a hybrid IC substrate 1 to be mounted. This pressing state is held at the other end side opposite to the end in such a manner that a lead terminal 7b connected integrally with the terminal 7a is interposed by the clip at the end for the substrate 1, and held. A conductive land 3 is not formed at the edge of the substrate 1 held by the terminal 7b. The substrate is solder dipped to solder the terminal 7a to the land 3, and the terminal 7b is not contacted with the land. Thus, after they are separated, the entire lower surface of the substrate 1 is soldered to a heat sink plate 2. |
