| 摘要 |
PURPOSE:To improve the efficiency of inspection while facilitating work by obtaining combined focal images to each layer and inspecting several circuit pattern when a plurality of the layers to which the circuit patterns are each connected are laminated on a light-transmitting body to be inspected and these patterns are inspected by using an optical system. CONSTITUTION:A light-transmitting body to be inspected is constituted by a semiconductor such as a semiconductor wafer 1, and a plurality of layers 1a-1c to which circuit patterns 2a-2c are each connected are laminated on the wafer 1. Optical system beams are projected from the surface of the wafer 1 in order to decide acceptable or defective patterns 2a-2c, but the focal surface of an optical system is changed at that time and the combined focal image of the pattern 2a is detected first. Accordingly, focal images with other patterns 2b and 2c are dimmed, and only the pattern 2a is made clear. The same operation is conducted to the pattern 2b and successively the pattern 2c, and acceptables or defectives are extracted and inspected regarding all patterns. |
