| 摘要 |
In a multilayer printed circuit board comprising an insulating substrate and a plurality of circuit elements provided thereon in layers, each of which is composed of a circuit pattern and an insulating resin layer provided over the circuit pattern, the circuit patterns arranged adjacently to each other being portionwise connected electrically through via at least one hole, the improvement in which said insulating resin layer comprises a photoset resin of an aromatic polyamide having at least 10 molar % of a constitutional unit of the formula (Ia): <IMAGE> (Ia) wherein each of R1 and R2 independently is a hydrogen atom or a residue of a reactive organic compound, Ar1 is a divalent aromatic residue, and Ar2 is a divalent aromatic residue possessing a photosensitive group. |
