| 摘要 |
PURPOSE:To obtain a photosensitive resin capable of easily forming a relief pattern superior in humidity and heat resistances, and electric and mechanical properties, by substituting an org. group for H of the amide bond of an aromatic polyamide. CONSTITUTION:A photosensitive material soluble in org. solvent is made of an aromatic polyamide having structural units each represented by general formula ( I a) or ( I b) in which at least one of R1 and R2, or R1, R2, R3, and R4 is a reactive org. compd. residue, and the others are H, and Ar1, Ar3, and Ar4 are each an aromatic residue and Ar2 is an aromatic residue having a photosensitive group. Since this photosensitive material is superior in light transmittance and photocross-linking ability, it need not another photoresist, and since it is superior in solubility in org. solvents, it is very suitable for formation of a relief pattern. Since at least one of R1-R4 of said formulae is the residue of a reactive org. compd. having reactivity with H of the amide bond of polyamide, it has an effect for lowering hygroscopicity as compared with the polyamide having the H atoms of the amide bond nonsubstd. by it. |
