| 摘要 |
PURPOSE:To provide a printing medium free of adhesion of broken chips of a semiconductor layer to an object to be printed, wherein a conductor layer, a semiconductor layer and a current-passing layer are sequentially laminated on one side of an electrically insulating heat-transmitting material layer, and an ink layer comprising a sublimable dye is laminated on the other side. CONSTITUTION:A conductor layer 202 such as a vapor-deposited Al film, a semiconductor layer 203 and a current-passing layer 204 are sequentially laminated on one major surface of an electrically insulating heat-transmitting material layer 201 such as a PVC sheet, and an ink layer 211 comprising a sublimable dye is laminated on the otaer major surface of the layer 201 to obtain the objective printing medium. The medium is laid on the object 206 to be printed such as a paper, an electrode needle 207 is pressed against the current-passing layer 204, and a voltage is impressed. As a result, an electric current flows to heat a part 210 of the semiconductor layer 203, the sublimable dye in the ink layer 211 is vaporized by the heat, and is adhered to the object 206. |
