| 摘要 |
A method for forming a shallow trench isolation (STI) structure with reduced stress is described. An amorphous silicon layer is deposited on a trench surface of a shallow trench isolation structure, and the amorphous silicon is then oxidized by thermal oxidation to form a liner oxide. The thickness of the liner oxide is uniform to reduce stress caused by a liner oxide having non-uniform thickness in the prior art, and the leakage risk between the semiconductor devices can thus be prevented.
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