PROCESS AND APPARATUS FOR BONDING PARTICULATE MATERIAL, IN PARTICULAR CHIPS

摘要

For achieving optimum application of bonding agent to particulatematerial, in particular chips, without elaborate plant and machinery, it is proposed to carry out the application of bonding agent using a pneumatic conveyor device for material which is in any case present, by arranging at least one spray nozzle for bonding agent in at least one section of the pipes of the material transport device and spraying the particles which are transported in the form of a film, using this spray nozzle for bonding agent.